+86(512) 6741 2701  brad.liu@crest-group.net
Laser Decapsulation System
LASER DECAPSULATION SYSTEM
Laser Decapsulation System

激光IC开瓶器已经推出了PL101I和PL121I,这些型号能够将铜线IC剥离,也能对超小型封装进行剥离,不断追求可用性的提高。可以从当前的标准类型升级到新的“i”类型。

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Plastic Mold Decapsulation System
塑料模具去封装系统
Plastic Mold Decapsulation System

PS105是一种具有精密酸自动混合功能的塑料模具去封装系统。这会产生低或无样品损坏、低成本和高质量的贴纸。

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Dry Etching System
干法蚀刻系统
Dry Etching System

Dry Decapper ES 312是以反应性离子气体为主导,对集成电路等电子元器件上的树脂进行解封的优良系统。
We can promise the Efficient Dry Decapsulation for 3 samples at once by Automatic Matching and N2 gas regular blowing for residue.
Automatic Operation up to the end of Decap
Max 3 samples at once
High Repeatability Etching

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